Company Description:
Building Products & Materials Firm
Building Products & Materials Firm
Construction Executive Online
Construction Job Openings
Company News
- Intel Announces 2025 EPIC Supplier Award Recipients - Intel Newsroom (news.google.com)
- Intel Announces 2025 EPIC Supplier Award Recipients - Intel Newsroom (news.google.com)
- Substrate Like PCB Market Size | CAGR of 19.5% - Market.us (news.google.com)
- Saras Micro Devices Announces Participation in CHIPS - GlobeNewswire (news.google.com)
- ASE developing square packaging substrate tech to replace round wafers - Tom's Hardware (news.google.com)
- Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging - Manufacturing.net (news.google.com)
- Nvidia CEO says its advanced packaging technology needs are changing - Taipei Times (news.google.com)
- U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging - National Institute of Standards and Technology (.gov) (news.google.com)
- $100M Investment Will Propel Absolics Inc., Georgia Tech’s Advanced Packaging Research - Georgia Tech News Center (news.google.com)
- AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new tech - Tom's Hardware (news.google.com)
- Absolics secures $100 mn U.S. grant for glass substrate R&D - 매일경제 (news.google.com)
- SKC’s US affiliate Absolics receives $100 million in US R&D grants - KED Global (news.google.com)
- CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging - National Institute of Standards and Technology (.gov) (news.google.com)
- Global advanced IC substrate market set to surge to US$31.54 billion by 2029 - digitimes (news.google.com)
- Glass substrate technology gains traction for advanced packaging by 2026 - digitimes (news.google.com)
- GaN Substrate Market Size, Share & Growth Report, 2024-2032 - Global Market Insights Inc. (news.google.com)
- E&R Engineering Corp. Forms E-Core System Alliance: Leading Glass Substrate into the Mass Production Era - PR Newswire (news.google.com)
- TSMC Preps To Ramp Up Glass Substrate For NVIDIA In Race Against Intel & Samsung, First Chips To Drop By 2025-2026 - Wccftech (news.google.com)
- Flexible Substrate Market Size, Share & Trends Report - 2032 - Global Market Insights Inc. (news.google.com)
- Mitsubishi Materials develops world's largest rectangular silicon substrate for AI chips - digitimes (news.google.com)
- [News] Glass Substrate Mass Production is Nearing, with Tech Giants Leading the Way - TrendForce (news.google.com)
- Filing records reveal tech company behind major $10 billion RELLIS Campus investment - KBTX News 3 (news.google.com)
- Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley - AZoM (news.google.com)
- QROMIS Recognized with Frost & Sullivan's 2024 Global Enabling Technology Leadership Award for Addressing Cost and Reliability Challenges in the Gallium Nitride Semiconductors Market - PR Newswire (news.google.com)
- SK Group chief inspects Absolics’ glass substrate factory in U.S. - 매일경제 (news.google.com)
- Digital Printing Market Size, Share & Trends Report, 2030 - Grand View Research (news.google.com)
- Glass Substrate: The Upcoming Game Changer for AI - 테크월드뉴스 (news.google.com)
- Unlocking GaN’s full potential: an interview with Qromis - Yole Group (news.google.com)
- U.S. announces $75 mn grant for SKC’s Absolics - 매일경제 (news.google.com)
- Absolics awarded US$75 million CHIPS funds for glass substrates ... - eeNews Europe (news.google.com)
- SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules - AZoM (news.google.com)
- AST to Build FC-BGA Substrate Facility in Singapore - EE Times Asia (news.google.com)
- AST breaks ground on Singapore facility to produce high end substrates and develop advanced technologies to meet global demand - Singapore Economic Development Board (EDB) (news.google.com)
- Japanese printing group Toppan to build Singapore factory for high-end semiconductor material - The Business Times (news.google.com)
- Japan’s Toppan to build its first S’pore microchip materials plant, creating 350 new jobs - The Straits Times (news.google.com)
- Japan's Toppan to build Singapore chip package substrate plant - Nikkei Asia (news.google.com)
- Samsung Aims To Begin “Glass Substrate” Chip Mass Production By 2026 As It Races With Intel - Wccftech (news.google.com)
- Pentagon’s $40M to electronics company paves path for U.P. tech industry - MLive.com (news.google.com)
- Related Content: Has Silicon Photonics Finally Found Its Killer Application? | Features | Mar 2024 - Photonics Spectra (news.google.com)
- Growing Preference for High-Resolution Displays Amplifies - GlobeNewswire (news.google.com)
- Glass Substrate Market Size, Share & Analysis Report, 2025-2034 - Global Market Insights Inc. (news.google.com)
- Powertech bullish about year ahead due to AI PCs - Taipei Times (news.google.com)
- Semiconductor Substrate Market Size, Trends 2025-2035 - Future Market Insights (news.google.com)
- OKI develops GaN lifting-off/bonding technology on Shin-Etsu’s QST substrates - Semiconductor Today (news.google.com)
- Applied Materials cuts into supply chain for Intel glass substrate technology - digitimes (news.google.com)
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC - Business Wire (news.google.com)
- Global Sales of Sapphire Substrate Market is Expected to - GlobeNewswire (news.google.com)
- Next-Gen Intel Chips Will Feature More Sand As Glass Is Set To Replace Organic Substrate Materials - Wccftech (news.google.com)
- Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute - Business Wire (news.google.com)
- Shin-Etsu Chemical launches QST substrates for GaN power device growth - Semiconductor Today (news.google.com)
- Shin-Etsu Chemical to further drive forward its QST® substrate business for implementation in GaN power devices - Yole Group (news.google.com)
- Startup Chipletz selects Siemens EDA ... - eeNews Europe (news.google.com)
- Global Sapphire Substrate Market Forecast to 2028: Rising - GlobeNewswire (news.google.com)
- II-VI Inc and Element 6 to expand diamond substrate manufacturing - New Electronics (news.google.com)
- Shares of this obscure chip component supplier have surged by over 1200% in the past three years - Fortune (news.google.com)
- GaN Wide Bandgap Semiconductor Enabling 1200V and Beyond Power Switches, Now Commercially Available for 200 mm Large Scale Manufacturing - DVIDS (news.google.com)
- Wafer maker licenses GaN technology for power devices ... - eeNews Europe (news.google.com)
- Shin-Etsu licenses Qromis GaN technology ... - eeNews Europe (news.google.com)
- Printed Electronics Market Size | Industry Report, 2030 - Grand View Research (news.google.com)
- ASE and TDK Ally to Manufacture Embedded Substrates - CTIMES (news.google.com)