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Building Products & Materials Firm
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Company News
- Sean Kingston reportedly posts bond in wire fraud case - WSVN (news.google.com)
- Wire Sweep Characterization of Mu lti-tier Copper Wire Bondin g on Thermally-Enhan ced Plastic - ResearchGate (news.google.com)
- Figure 3. 3D structural diagram and RL-equivalent circuit of parallel... - ResearchGate (news.google.com)
- DriveWealth and Moment Partner to Democratize Fixed-Income Investing, Lowering Bond Investment Barriers - Business Wire (news.google.com)
- Figure 1. internal structure of wire-bond package IGBT modules and main... - ResearchGate (news.google.com)
- W+K London, Director Fredrik Bond Re-wire The Past With Modern Mischief, Take An Electrifying Ride In The Ford Capri - SHOOTonline (news.google.com)
- Maritime Link Financing Trust Completes $500 Million Bond Financing - Business Wire (news.google.com)
- Figure 9. XSEM of cracks in an experimental pad design having reduced... - ResearchGate (news.google.com)
- Fig. 1. 3-D FEM mesh showing Cu bonding process for round and dimple... - ResearchGate (news.google.com)
- Microresonator photonic wire bond integration for Kerr-microcomb generation - Nature (news.google.com)
- Fig. 4: Internal structure of a lead frame based module - ResearchGate (news.google.com)
- Wire bonding process: 1 Wires through capillary 2 Electro flame off 3... - ResearchGate (news.google.com)
- Figure 1: Inner structure of a MOSFET with a copper clip - ResearchGate (news.google.com)
- Figure 7. Intermetallic Compound (IMC) Coverage Formation at Zero Hours... - ResearchGate (news.google.com)
- Introducing the Bond Touch 4: Sleeker design, enhanced sensitivity and next-level communication - Business Wire (news.google.com)
- Breaking New Ground in Wire Bond Inspection with Capacitive Test Methods - EE Times Asia (news.google.com)
- Keysight Unveils Wire Bond Inspection Solution for Semiconductor Manufacturing - Metrology and Quality News (news.google.com)
- Keysight Intros Wire Bond Inspection Solution for High-Volume Semiconductor Manufacturing - The Fast Mode (news.google.com)
- Die Bonder Equipment Market Size | Industry Report, 2030 - Grand View Research (news.google.com)
- Brett Detamore placed on $50,000 bond for wire fraud after investigation into a fraudulent June 2023 disappearance - ABC13 Houston (news.google.com)
- FBI Houston: 53 indicted in wire fraud scheme linked to bail bonds, 3 wanted - FOX 26 Houston (news.google.com)
- OLAPLEX Launching New Patented OLAPLEX Bond Shaping Technology™ - Business Wire (news.google.com)
- Fig. 1. Cross-section image of Cu-Al ball bond interface. - ResearchGate (news.google.com)
- The interfacial microstructures of Au wire bonding of a–c anode side nd d–f cathode side after EM test - ResearchGate (news.google.com)
- No Time to Die: How Steven Spielberg and Eric Bana Convinced Daniel Craig to Play James Bond - SYFY (news.google.com)
- Are No Time to Die's Designer Diseases Possible in Real Life? The Science Behind Bond - SYFY (news.google.com)
- Bourbon Review: High Wire Jimmy Red Bourbon Whiskey Bottled in Bond Single Farm Edition - The Whiskey Wash (news.google.com)
- Hill’s Pet Nutrition and Bond Pet Foods Reach Milestone Toward Development of a More Sustainable Protein for Pet Foods - Business Wire (news.google.com)
- Plug-and-Play Fiber-Coupled Quantum Dot Single-Photon Source via Photonic Wire Bonding - Wiley Online Library (news.google.com)
- Knightscope Launches $10M Public Safety Infrastructure Bond Offering - Business Wire (news.google.com)
- Wirebonding Is Here To Stay - Semiconductor Engineering (news.google.com)
- Temperature sensors: TDK launches new Au wire bond-optional NTC thermistors for laser diode temperature measurement - TDK Corporation (news.google.com)
- Fig. 10: Comparison of gold wire bond pull test results for ENEPIG... - ResearchGate (news.google.com)
- Advanced chip packaging: How manufacturers can play to win - McKinsey & Company (news.google.com)
- 3D Structures Challenge Wire Bond Inspection - Semiconductor Engineering (news.google.com)
- Fig. 7: The effect of wirebonding locations on insertion loss are... - ResearchGate (news.google.com)
- Happy’s Tech Talk #14: Palladium as a Final Finish - I-Connect007 (news.google.com)
- The Rise Of Copper Wires In Automotive ICs - Semiconductor Engineering (news.google.com)
- Kulicke & Soffa Collaborates with LeYu Precision to Deliver Production-Proven Automated Material Handling Systems - StreetInsider (news.google.com)
- Photonic Wire Bonding: Using Lasers to Integrate Lasers | Features | Aug 2022 - Photonics Spectra (news.google.com)
- The Race To Zero Defects In Auto ICs - Semiconductor Engineering (news.google.com)
- Amelia Bond to Retire From St. Louis Community Foundation Leadership Position in 2023 - Business Wire (news.google.com)
- Morphology of epoxy molding compound of Au wire bonding after EM - ResearchGate (news.google.com)
- American Express Issues Inaugural $1 Billion ESG Bond - Business Wire (news.google.com)
- Automotive Supplier Selects Multi-Function System for 3D Wire Bond Inspection and Metrology - Metrology and Quality News (news.google.com)
- Bake test results for PdCu and Cu wire bonds - ResearchGate (news.google.com)
- Photonic Wire Bonding Process Could Open Door to More Photonic Electronics - All About Circuits (news.google.com)
- Partners tout benefits of photonic wire bonding - lightwaveonline.com (news.google.com)
- Technology Advances, Shortages Seen For Wire Bonders - Semiconductor Engineering (news.google.com)
- Figure 1: schematic of wire bond package and flip chip package I.... - ResearchGate (news.google.com)
- How wire is a critical component in the automotive industry's shift to electric vehicles - Business Insider (news.google.com)
- Distribution of Pd over the FABs of the Pd-coated Cu wire with... - ResearchGate (news.google.com)
- Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements - Nature (news.google.com)
- 007 targets a massive conspiracy in Dynamite's new 'James Bond: Himeros' comic miniseries - SYFY (news.google.com)
- Effect of load sequence interaction on bond-wire lifetime due to power cycling - Nature (news.google.com)
- Fig. 1. A bond loop with ball bond formation at chip and wedge bond at... - ResearchGate (news.google.com)
- The 'lost' James Bond movies of the '80s are like an alternate 007 universe - SYFY (news.google.com)
- First Look: The Living Vampire's bloodlust begins in Marvel's Morbius: Bond of Blood #1 - SYFY (news.google.com)
- Kulicke & Soffa Announces Orders of 1,500 RAPID™ Series System Increases Production Capacity to Meet Demand - Business Wire (news.google.com)
- Better Analytics Needed For Assembly - Semiconductor Engineering (news.google.com)
- The Race To Much More Advanced Packaging - Semiconductor Engineering (news.google.com)
- Fig. 20. Carrier board consisting of Tx and Rx MMICs, wire-bond... - ResearchGate (news.google.com)
- Laser polymerized photonic wire bonds approach 1 Tbit/s data rates - Nature (news.google.com)
- Fig. 5. Cross section location of wire interconnection (Left: Wires on... - ResearchGate (news.google.com)
- Fig. 1. A standard power module. - ResearchGate (news.google.com)
- Vertical integration of microchips by magnetic assembly and edge wire bonding - Nature (news.google.com)
- The package interconnect selection quandary - EE Times (news.google.com)
- Figure 1: Cu-Al Wire Bond at As-bonded Stage - ResearchGate (news.google.com)
- Pierce Brosnan voices support for a female James Bond: 'It would be exciting' - SYFY (news.google.com)
- Battery bonding: Ultrasonic wire bonding vs laser welded bonding - Charged EVs (news.google.com)
- Performance comparison of III–V//Si and III–V//InGaAs multi-junction solar cells fabricated by the combination of mechanical stacking and wire bonding - Nature (news.google.com)
- Making the Connection: Copper Bond Wire - The Aerospace Corporation (news.google.com)
- Simulated Q-factor of a bonding wire with (solid line) and without (dotted line) pad capacitance influence. - ResearchGate (news.google.com)
- Table 2 . Details of the bond time T, ultrasonic power US, bond force... - ResearchGate (news.google.com)
- Fig. 15 Stitch pull results on Au and Cu wire bonding. - ResearchGate (news.google.com)
- Table 8 . Initial Wire Bond Results for Nickel/Thick Palladium/Gold... - ResearchGate (news.google.com)
- Figure 2. Distributions of contact resistance of wire bonds at... - ResearchGate (news.google.com)
- Fig. 3. Tail bond detaching away from stitch bond [21]. - ResearchGate (news.google.com)
- Figure 7: MPO failures on CMOS090 after wire pull testing. - ResearchGate (news.google.com)
- Wire-bonding assembly - Nature (news.google.com)
- Figure 15: TEM image of an aluminum coated copper bonding wire top surface - ResearchGate (news.google.com)
- Optical wire bonding makes for simple hybrid photonics ... - eeNews Europe (news.google.com)
- Table 1 : Material properties of different wire bond material [16]. - ResearchGate (news.google.com)
- Free-space photonic wire bonds connect III-V and Si photonics on separate chips - Laser Focus World (news.google.com)
- Figure 1. Long Wire Chip-to-Chip Wire Bonding Using X-Wire™. The... - ResearchGate (news.google.com)
- Fig. 1. Cross section through a coplanar wire bond interconnect - ResearchGate (news.google.com)
- Figure 5. Zoomed in X-ray image for wire bond reference tool - ResearchGate (news.google.com)
- X-ray tomography images of the first two bonds in X–Y plane. - ResearchGate (news.google.com)
- Proposed Cu ball bond corrosion failure mechanism in UHAST tests (Leg... - ResearchGate (news.google.com)
- Proposed Cu ball bond oxidation mechanism due to long staging at... - ResearchGate (news.google.com)
- Figure 4. Example of Crossing Wires in the Same Tier using X-Wire™ - ResearchGate (news.google.com)
- Mitsubishi Electric increases reliability of automotive power modules with direct lead bonding - Charged EVs (news.google.com)
- Fitch Ratings Joins J.P. Morgan High-Yield Bond Indices - Business Wire (news.google.com)
- Wirebond Technology Rolls On - Semiconductor Engineering (news.google.com)
- A closer look at wire bonding - Charged EVs (news.google.com)
- A proton wire to couple aminoacyl-tRNA accommodation and peptide-bond formation on the ribosome - Nature (news.google.com)
- The Plating Forum: Wire Bonding to ENIG - I-Connect007 (news.google.com)
- XRM Characterization for Determining the Reliability of Wire Bond Packaging Processes - AZoM (news.google.com)
- Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging - Wiley Online Library (news.google.com)
- KIT develops "photonic wire bond" for optical chip connections - Laser Focus World (news.google.com)